Drawing Die 3D Profile Measurement System for Die Inspection

[Sipcon]

Sipcon provides advanced optical technology for fast and accurate inspection of drawing die internal geometry. The drawing die 3D profile measurement system captures the complete inner profile with high-precision optical imaging, allowing manufacturers to inspect critical die geometry in detail. Green collimated illumination highlights die contours for clear edge detection and accurate measurement. The system evaluates die angle, reduction angle, approach angle, bearing length, profile geometry, wear, and geometry deviation. Its 360° measuring capability supports inspection of small, ultra-fine, and complex-shaped dies, while automated reports can be generated in Excel and PDF formats. Sipcon supports reliable drawing die quality control and process monitoring.
Get in Touch with Sipcon Technologies Pvt. Ltd.
Website: https://www.sipconinstrument.com/italy/
Email: eu@sipconinstrument.com
Phone: +39 3404042357